ラピダス、半導体「後工程」を技術開発へ　国が新たに５９００億円支援

　次世代半導体の国産を目指すラピダス（東京）は２日、製品を組み立てる「後工程」の先端技術開発に乗り出すと発表した。経済産業省は同日、最大５９００億円の追加支援を発表。官民一体で、人工知能（ＡＩ）や自動運転システムに使われる次世代半導体について、２０２７年の量産実現を目指す。
　すでに研究開発に着手している製造の中心「前工程」に加え、後工程も一貫して手掛けることで、設計から製造までにかかる時間を短縮し、競争相手との差別化を図る。都内で記者会見した小池淳義社長は、「ライバルに対して２倍以上のスピードで作る」と強調した。
　追加支援５９００億円のうち、５３５億円を最先端のパッケージング技術など後工程の開発費用に充てる。北海道千歳市のセイコーエプソン事業所の一部を活用する。（2024/04/02-19:57）

Japan's industry ministry said Tuesday that it has decided to provide up to 590 billion yen in additional assistance to Rapidus Corp., which is aiming to domestically produce next-generation semiconductors.
   Through the additional aid, the ministry hopes to help the Japanese company accelerate the development of advanced chips, essential for autonomous driving and artificial intelligence technologies.
   As the ministry has already committed 330 billion yen to Rapidus, the total state assistance to the chipmaker will reach nearly 1 trillion yen.
   "The next-generation semiconductors that Rapidus is working on are the most important technology that will determine the future of Japanese industries and the future economic growth of Japan," industry minister Ken Saito said at a press conference Tuesday. "We will do our best to support the project for its success."
   Rapidus was established in 2022 to produce chips with a circuit line width of 2 nanometers, the most advanced type of semiconductor. It has received investment from eight major Japanese companies including Toyota Motor Corp., Nippon Telegraph and Telephone Corp. and NEC Corp.