半導体支援で１兆８６００億円　２３年度補正予算案に計上へ―政府方針

　政府は８日、半導体の国内生産の支援のため、２０２３年度補正予算案に約１兆８６００億円を計上する方針を固めた。経済安全保障推進法に基づき「特定重要物資」に指定されている半導体の安定供給に向けて、生産拠点の整備などを促進する。
　半導体の生産や開発を支援する関連３基金に積み増す費用を計上する。具体的には、次世代半導体の国産化を目指すラピダス（東京）への支援を念頭に置いた基金に約６５００億円を計上。先端半導体の生産拠点整備を支援する基金には約６３００億円、国内の安定供給確保につなげる基金には約５８００億円をそれぞれ充てる。
　政府はこうした基金を活用し、半導体受託製造最大手の台湾積体電路製造（ＴＳＭＣ）が熊本県で検討する国内第２工場の整備への補助などを想定している。（2023/11/08-17:39）

The Japanese government plans to earmark 1.86 trillion yen in spending in a fiscal 2023 supplementary budget proposal to support the domestic production of semiconductors, informed sources said Wednesday.
   The money will be used to increase the budgets of three funds that support chip production and development in an effort to ensure stable supply of the products that have become increasingly important in terms of economic security.
   Specifically, the government is set to allocate some 650 billion yen to a fund aimed at providing financial support to Rapidus Corp., a Japanese company seeking to achieve mass production of next-generation chips.
   A fund designed to facilitate the construction of production bases for cutting-edge chips is slated to receive 630 billion yen, and a fund aimed at ensuring stable domestic chip supply is expected to receive 580 billion yen.
   The government plans to utilize the funds to provide subsidies to the second chip plant in Japan being considered by Taiwan Semiconductor Manufacturing Co., the world's largest contract chipmaker, in the southwestern prefecture of Kumamoto.